Detailed Sound with ESS Sabre DAC Chipsets

The FiiO K19 houses the two flagship ESS 8-channel ES9039SPRO DAC chipsets. These chips utilise the fourth-generation 32Bit HyperStream architecture, delivering ultra-high dynamic range and minimal noise. The FiiO K19 ensures clear, rich audio output with exceptional detail, with a remarkable -122dB THD+N and 132dB DNR.

Features THX AAA 788+ And Op-amps For Powerful Amplification

The FiiO K19 features an advanced headphone amplifier design with an 8-channel THX AAA 788+ architecture. This amplifier circuit functions parallelly, supported by a high-voltage power supply. The THX amp chips are grouped in 2×2 sets to create a fully balanced 4-channel amplification system, delivering improved transients and a high-power output of up to 8000mW+8000mW into a 32-ohm load. This design enables the FiiO K19 to drive a wide range of headphones while maintaining distortion-free power output. Also, the OPA2211 and OPA1602 op-amps ensure stable, high-quality sound across I/V, LPF and preamplifier circuits.

Accurate Audio Across Sampling Rates With Crystal Oscillators

The FiiO K19 utilises two high-performance ACCUSILICON AS318-B femtosecond crystal oscillators (45.1584MHz, 49.1520MHz), known for their ultra-low phase noise characteristics. These oscillators undergo rigorous pre-screening, ensuring their quality before housing into the FiiO K19. They minimise phase noise and contribute to accurate audio reproduction across various sampling rates for a clean and more stable sound regardless of your source sampling rate. 

Minimal Distortion With DSP Chipset And SHARC+ Core

For the first time in FiiO product, they have introduced the ADI ADSP-21565 DSP chip with SHARC+ core, paired with a custom ultra-low phase noise femtosecond crystal oscillator. The DSP chip operates at a high clock frequency range of 800MHz and enables 64-bit double-precision floating point calculations. It provides a 31-band high-precision lossless PEQ and robust system protection for the K19 and connected devices, ensuring high-quality audio with minimal distortion.  

Quad Core FPGA Architecture For Clean Signal Transmission

The FiiO K19 features a quad-core FPGA for digital signal processing for Bluetooth, USB, coaxial, optical, HDMI/ARC signal decoding and DSP processing. It transmits these signals through dual ES9039SPRO DACs through two sets of I2S channels for minimal distortion. It also features Global clock management to ensure low-jitter signals, with a fully balanced design to reduce crosstalk. 

Sound Customization With 31-band PEQ With DEL Technology

The FiiO K19 offers a 31-band high-precision lossless PEQ with DEL technology for dynamic range effects and an advanced limiter to prevent clipping. It supports direct adjustment of PCM 44.1k~192k audio signals without sampling rate conversion. You can adjust each band's gain from +12 to -24dB and the Q value from 0.4 to 128 dB. Your PEQ presets can be shared, imported and exported using Windows, Mac, or the mobile app, expanding sound adjustment options.

Embedded With Quality Components For Powerful Performance

The FiiO K19 equips quality components like the Panasonic film capacitors and MELF resistors, for maintaining stable sound across temperature changes. Its NEUTRIK gold-plated connectors are oxidation-resistant for reliable connections. The FiiO K19 aims to deliver improved sound quality and a wider soundstage with WIMA and ELNA SILMIC II capacitors. It employs silver-plated oxygen-free copper cables for minimal signal loss and high-fidelity audio transmission between internal components.

Noise-free Audio With Shielded and Separated Circuit Design

The FiiO K19 features separated and shielded circuit boards for better performance. Its digital and analog audio circuits are isolated on separate boards to reduce interference, with metal shields on the DSP, DAC and THX amplifier boards. The design includes compartmentalised aluminium alloy for isolating the digital and module boards, reducing crosstalk and improving signal purity. The honeycomb-mesh aluminium alloy body also reduces external interference, delivering a pure and clean music-listening experience. 

Robust Power Supply System Delivering Low-Noise Power

The FiiO K19 has a meticulous power supply system with a DC/AC dual power supply, offering a 40W industrial-grade unit with low noise and high efficiency. It supports a wide input voltage range (85-305VAC) and extreme temperatures and can also use an external DC power supply (15V-3A) for enhanced audio performance. The FiiO K19 has separate analog and digital power supplies to prevent interference and it also has a multi-stage analog power supply with LDOS for clean and stable power for optimal audio quality across different circuit stages. 

Versatile Connectivity With Multiple Inputs And Outputs

The FiiO K19 has six operating modes, including four analog outputs (volume adjustable) and two digital outputs (COAXIAL and OPTICAL). It features USB decoding with XMOS XU316 for high resolution up to 768kHz/32bit, DSD512 and MQA decoding. Bluetooth input supports aptX HD/aptX Adaptive/LDAC codecs. It also has optical, coaxial, and HDMI inputs, with HDMI ARC support for TV audio return and HDMI decoding up to 192kHz/24bit. 

12V Trigger, GND/LIFT Switch And Remote Control For Elevated User Experience

The FiiO K19 features a bidirectional 12V TRIGGER that enables active and passive control modes for synchronised power management switching with other 12V TRIGGER devices. It includes a GND/LIFT ground switch to minimise crosstalk and interference between devices. The FiiO K19 supports the FiiO Control app for convenient access to various functions. The FiiO K19 comes with a custom infrared remote control for remote operation, allowing you to switch between modes, select EQ settings, adjust volume and perform other functions from a distance. 

Meticulous Aluminium Alloy Build And A Flexible Placement Design

The FiiO K19 showcases a new flagship design with an ultra-thin, shock-proof die-cast unibody aluminium alloy construction. The body is meticulously polished using a multi-axis CNC machine, resulting in a thinner yet durable construction. When combined with the stand, the FiiO K19 offers stability and convenience. Its flexible design allows vertical and horizontal orientations, saving space and effectively dissipating heat. In vertical mode, it serves as a distinctive headphone stand, elevating your user convenience. 

Dual Heat Dissipation Design To Avoid Overheating

The FiiO K19 has a dual heat dissipation system: internally, the thermally conductive materials transfer heat to the aluminium alloy frame, while externally, a honeycomb mesh design promotes convection heat dissipation. This setup enables high power output without overheating. The silicone heat dissipation area is 31717 mm2, while the honeycomb mesh area is 4620 mm2, improving the cooling capacity of the FiiO K19.